High Performance IC Design - ELEC870
From modern telecommunications to tablet computing and from mobile handsets to the cloud, the limits of integrated circuit technology are being pushed to the limits of what is possible in terms of speed, size, and power. Beyond the IC itself, packaging concerns, both electrical and thermal, provide additional constraints in the design of the modern high performance integrated circuit. This unit will be taught from the research of both resident and visiting staff as well as from the latest research around the world.
| Credit Points: | 4 |
| When Offered: | S2 Day - Session 2, North Ryde, Day |
| Staff Contact(s): | Dr Surya Sharma |
| Prerequisites: |
Admission to MEng and 12cp at 600 level or above
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| Assessed As: | Graded |
| Offered By: | Department of Engineering Faculty of Science and Engineering |
Course structures, including unit offerings, are subject to change.
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