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High Performance IC Design - ELEC870
From modern telecommunications to tablet computing and from mobile handsets to the cloud, the limits of integrated circuit technology are being pushed to the limits of what is possible in terms of speed, size, and power. Beyond the IC itself, packaging concerns, both electrical and thermal, provide additional constraints in the design of the modern high performance integrated circuit. This unit will be taught from the research of both resident and visiting staff as well as from the latest research around the world.
| Credit Points: | 4 |
| When Offered: | TBD - Not offered in the current year; next offering is to be determined |
| Staff Contact(s): | Professor Michael Heimlich |
| Prerequisites: |
Admission to MEng and ELEC676 |
| Corequisites: | |
| NCCW(s): | |
| Unit Designation(s): | |
| Assessed As: | Graded |
| Offered By: | Department of Engineering Faculty of Science and Engineering |
Timetable Information
For unit timetable information and session dates for external offerings please visit the Timetables@Macquarie Website.